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productronica 2021 20 Die offizielle Messezeitung www markttechnik de Test Measurement Inspection and test systems for electronics assembly production News from SPI AOI and AXI At this year’s productronica inspection system manufacturers will finally meet in person again And they have brought with them many innovations Here are some of the most interesting ones In terms of size modern electronics assemblies now range from small and light to very large and heavy Many automated Xray inspection AXI systems reach their limits here because they tend to be designed to handle standard inspection tasks In terms of specimen transport and image acquisition these AXI systems are not usually flexible enough for the full range of inspection tasks The new fleXLine · 3D inline Xray system from Göpel Electronic Hall A1 Booth 235 is different Thanks to its variable belt conveyor it can transport assemblies that are both small and light and large and heavy Maximum device under test DUT dimensions are 24 inches 610 mm × 20 inches 508 mm which can optionally be increased to 47 inches 1200 mm × 20 inches 508 mm maximum weight is 33 lbs 15 kg The inspection of loose DUTs and thin flexible PCBs in carriers or blisters is equally possible In addition the system is built around a new image acquisition technology in which the system holds the DUT at rest during 2D 2 5D and 3D Xray inspection tasks For example heavy boards can be inspected directly in the carrier frame – without an additional mechanism to hold them in place during image acquisition The new fleXLine · 3D granitebased 6-axis system implements high speed movement of the image acquisition components with high repeatability For the first time the system supports both line and area detectors as well as different Xray sources In a further development step a concept for selfmonitoring and calibration has been implemented AXI – also for heavyduty applications Market leader Viscom Hall A2 Booth 177 also comes to Munich with interesting innovations The focus is on AXI AOI and SPI as well as the continuous statistical monitoring of individual manufacturing steps and support for standards such as IPC Hermes 9852 and IPC CFX Current highlights include the new iX7059 generation of inline Xray systems Thanks to the flexible inspection concepts the new systems cover a broad spectrum of requirements that have a much wider application than classic printed circuit boards The 3D AXI system iX7059 Heavy Duty Inspection which belongs to this new generation will be on view at productronica Afeature is its rapid handling of inspection objects weighing up to 40 kg and state of the art Xray technology with powerful radiation The iX7059 Heavy Duty Inspection is customized in particular to handle encased components and the requirements of power electronics Typical uses include electromobility telecommunication and renewable energies Thanks to features like a new generation of flatpanel detectors the powerful computed tomography of the iX7059 systems provides excellent slice images and therefore also optimal presentation and very simple verification The innovative dynamic 3D Evolution 5 imaging technology enables several hundred images to be captured from a number of different viewpoints in just a few seconds to obtain an unambiguous threedimensional analysis For example voids in surface solder joints can lead to overheating if they are present in excessive numbers or if their diameter is too large as they prevent flawless heat dissipation Their size and percentage incidence in the overall surface of the soldered joint are measured during inspection Their number is also calculated with the greatest possible precision Other types of defects which are detected by the iX7059 Heavy Duty Inspection are mechanical damage twisted missing and incorrect components as well as the degree of filling and pin heights in THT solder joints In addition to this AXI innovation Viscom will be exhibiting solutions for manual Xray for AOI and SPI as well as for optical wire bond inspection at productronica The VT-S1080 3D AOI system from Omron features several patented technologies The iX7059 Heavy Duty Inspection 3D AXI system from Viscom also handles inspection objects weighing up to 40 kg Now even more flexible the new generation of the Phoenix V|tome|x Sindustrial 2D Xray and 3D CT systems from Waygate Robotbased AOI with AI In the field of robotbased automated optical inspection AOI Israeli manufacturer Kitov Hall A2 Booth 301 is coming up with a world first that Kitov sales partner ATEcare is convinced “will revolutionize the market – and not just for electronics products ” An inspection unit installed on a robot inspects devices individual parts or even PCBs fully automatically from all directions In the process the robot is not programmed at all but follows the known CAD data In doing so the inspection uses AIbased algorithms to search for defects such as scratches positioning inscriptions screws connectors THT components barcodes – anything that a human can see the system can do a little better consistently and quickly “We like to be stingy with the term AI – here it is part of a hybrid solution ” emphasizes Olaf Römer CEO of ATEcare Patented AOI solutions in focus One of the highlights at Omron Hall A2 Booth 433 sales ATEcare is the VT-S1080 3D AOI system For this purpose a completely new automated optical inspection AOI light unit has been developed and patented MDMC illumination The proven DLP Projection has been doubled and now uses the also patented Multiple Phase Shift MPS technology to generate shadowfree but also without interpolation cleanest image material 5 megapixel side cameras complement the new 12 megapixel top camera Also on display at Omron is the VP9000 3D SPI system Not only does it feature new system hardware but the software also has many innovations to offer Completely new and patented for example is the option to triple the resolution of the system if required and FOV so that even the smallest structures can be measured with the same machine but the highest throughput is always guaranteed if required Microand nanofocus Xray and CT Microand nanofocus Xray and computed tomography CT inspection systems for the electronics and battery industries are on the trade fair program at Waygate Hall A2 Booth 415 One highlight is the next generation of the Phoenix V|tome|x Sindustrial 2D Xray and 3D CT systems In addition to the proven Dual|tube configuration option it now also features a dynamic-41|200p+ detector This achieves even higher resolution and image quality with significantly faster scan times The new DXR-S100-Pro option even offers a pixel size of 100 µm for detection of the smallest defects The spacious cabinet design makes sample changes easier Thanks to Dual|tube technology the V|tome|x S Neo can automatically switch between a 180 kV 20 Whighpower nanofocus Xray tube and a 240 kV 320 Wmicrofocus Xray tube within minutes This makes the system suitable for traditional inspection in the electronics and automotive industries as well as for research and development for a wide range of applications from extreme high resolution nanoCT scans of low absorbing materials with detail detectability of up to 200 nanometers as well as for 3D microCT analysis of higher absorbing objects with a diameter of up to 400 mm The CT system is equipped with an additional tilting axis enabling flexible 2D Xray inspection Trend topic LED testing Faster testing of light emitting diodes LEDs with laboratory accuracies is the focus at the trade fair presentation of Premosys Hall A1 Booth 160 Among other things the company will show representatives of its eFLAT systems which are