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Die offizielle Messezeitung 1 www markttechnik de Messezeitung Die offizielle World �s leading trade fair for electronics development and production Published by New test methods from ERS Test costs will fall significantly For the first time complex ICs can now be tested under voltage and temperature not only in the final test but also at the waferlevel This increases the yield and significantly reduces costs “This makes chipletbased processors affordable while simpler microcontrollers for cars can now be produced more costeffectively ” says Klemens Reitinger CTO of ERS Markt Technik ERS has so far been very successful with aircooled chuck systems developed inhouse and has consistently emphasized the advantages of this technology compared to liquidcooled chucks Just in time for Semicon Europa ERS is now presenting a new watercooled chuck here at the fair Why the change of heart? Klemens Reitinger This may sound like a change of heart at first but in fact it is not We remain convinced that aircooled thermal chuck systems are the better option for the vast majority of applications and we basically stick to our philosophy of using air cooling wherever possible But above all the fact that the new chucks are liquidcooled is not the innovation but rather just a byproduct so to speak So what is the really new development that ERS is presenting at Semicon Europa? Ithink the best place to start is at the top level the application All manufacturers of ➡ Page 7 Das von Klepp Absauganlagen vertriebene kompakte Reinraumgerät »DAIR« verbessert die Luftreinheit am Arbeitsplatz Es hält die Arbeitsflächen frei von Schwebstoffen und erzeugt zugleich eine unsichtbare »Reinraum-Blase« am Arbeitsplatz Das mobile Absauggerät DAIR wartet mit einer laminaren Reinluftströmung von 0 5–0 6 m s auf und absorbiert Partikelgrößen > 0 3 µm Zudem bläst es konstant Reinluft über den Arbeitsplatz wobei der laminare Luftstrom nicht zu » Reinraum-Blase« für den Arbeitsplatz ➡ Seite 9 Klemens Reitinger CTO of ERS Bild Klepp D AIR System processors and microcontrollers but in particular manufacturers of highend CPUs GPUs and AI processors regardless of whether they are IDMs or foundries are facing a huge problem You cannot perform a full waferlevel test on these ICs Whether they work or not is only revealed during final test i e after the ICs have been separated However being able to sort out faulty ICs only after the final test costs much more than if they could be identified on the wafer in advance Why is this especially true of the highend devices? In principle because these devices are no longer integrated monolithically Instead manufacturers produce individual functional blocks separately in the most suitable available process technology These socalled chiplets are then integrated into housing using advanced packaging techniques For this to be costeffective the chiplets must be Known Good Dies If they can only be tested for their functionality in the package during the fiproductronica-Premiere Das Bundesministerium für Bildung und Forschung präsentiert den »Inno Truck« Dieser zum Forschungslabor umgebaute LKW soll auf spielerische Weise das Interesse für Technologien fördern und gleichzeitig Nachwuchskräfte für technische Berufe begeistern Der InnoTruck steht zwischen den Hallen A1 und B1 Highlights Exhibition Map Events pp 4–6 ROI Optimization in Electronics Manufacturing p 8 Test Measurement pp 10–11 Semiconductor Technology pp 14 17 PCB Assembly pp 15–16 22 Electronics Manufacturing Services p 18 Soldering pp 19–20 PCB Inspection p 23 Visit the WEKA stand at productronica Hall A2 Booth 577 Bi ld Bun de sm in is te ri um fü r Bild un g un d Fo rs ch un g