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8 The Official Daily Tag 1 – Dienstag 12 November 2024 Semiconductors ❚ Höcherl Hackl Many load channels triggered synchronously Afacelift and a wide range of load modules will be available in the future for the H H PMLA multichannel load series of Höcherl Hackl Standard multichannel loads have so far offered a power of up to 600 Wper load channel Now the multichannel system can be expanded with powerful channels of up to 2 100 Wwhich are housed in a separate 2 Ucase The high power channel is connected to the master device as a slave device via the system bus Similarly there will be a solution with even more than the previous 12 channels in a single housing In addition a synchronization solution provides offsetfree triggering for systems with mixed series nw Höcherl Hackl Hall A4 Booth 214 and 300 Bi ld Höc he rl Hac kl ❚ NXP Semiconductors Automotive electrification and industrial ❚ Texas Instruments Asmarter and more sustainable future ❚ Renesas Electronics MCUs with touch high power efficiency and security At the NXP stand visitors can gain a firsthand insight into the company‘s diverse portfolio Atotal of 18 demos developed in close collaboration with leading partners and customers provide an opportunity to experience NXP‘s latest solutions for the automotive industry electrification and industrial applications One highlight is the NXP CoreRide platform for softwaredefined vehicles SDVs in which the company combines its proven S32 computing networking and energy management capabilities plus readytouse software from the company‘s extensive ecosystem of software partners st NXP Semiconductors Hall C4 Booth 279 At the show Texas Instruments will demonstrate how its semiconductors software and design expertise help developers meet the growing demand for smarter datadriven decisionmaking In factory automation TI will showcase its certified productionready hardware and software for industrial communication with software stacks for Profinet EtherCAT and EtherNet IP Apickandplace demonstration from the robotics sector is based on the phy-CORE-AM68A SoM and uses the Armbased AM68A processor with a deep learning accelerator and an edge AIbased model to determine human posture in order to control the robot arms precisely In the field of industrial and automotive systems TI is demonstrating arc detection in PV systems with edge AI microcontrollers that process NN models thus relieving the CPU TI is also demonstrating a gateway for SDVs and a GaNbased PV inverter with 10 kW output high power density and 98 percent efficiency for sustainable energy st Texas Instruments Hall C4 Booth 159 Renesas Electronics estimates that the new 64 MHz MCUs – the RX261 RX260 MCUs – have a power efficiency of 69 µA MHz in active mode and 1 µA in standby mode The RX261 RX260 Group MCUs are based on Renesas’ RXv3 CPU core enabling 355 CoreMark at 64 MHz According to the company this score is 2 5 times higher than competing 64-MHz class MCUs Compared to other 64-MHz class MCUs the RX261 RX260 also delivers 25 percent lower active current and 87 percent lower standby current Renesas’ thirdgeneration capacitive touch IP CTSU2SL delivers high noise immunity and water resistance allowing users to implement touch sensors in kitchen appliances and outdoor equipment such as smart locks The automatic judgement function reduces current consumption during intermittent operation by enabling touch detections even in standby state The QE for Capacitive Touch tuning tool design guides and sample programs ease the implementation of touch sensors in multiple applications By implementing security features with the Renesas Secure IP RSIP-E11A and flash protection functions users can protect their applications from unauthorized use such as data falsification and eavesdropping by attackers Sample programs help users to implement secure boot and secure firmware update functions quickly and easily st Renesas Electronics Hall B4 Booth 179 ❚ Rohm Semiconductor »Empowering Growth Inspiring Innovation« ❚ Alpha and Omega Semiconductor Applicationspecific solutions Rohm Semiconductor will showcase its advanced power and analog technologies designed to enhance power density efficiency and reliability in both automotive and industrial applications Under the theme »Empowering Growth Inspiring Innovation« Rohm will highlight via its various demo application stations how its semiconductor technologies contribute to solving critical social and ecological challenges The latest solutions will be exhibited under the three themes of for »E-Mobility« »Automotive« and »Industrial« For E-Mobility Rohm will showcase for example TRCDrive pack with 2-in-1 SiC molded module new EcoIGBT products and new EcoSiC Schottky barrier diodes For Automotive Rohm presents a new configurable PMIC with supporting functional safety features for application processors SoCs and FPGAs LED driver ICs and for industrial equipment visitors will see industrial AC-DC PWM controller ICs and the EcoGaN family of 150 Vand 650 Vclass GaN HEMTs in several EVKs st Rohm Semiconductor Hall C3 Booth 520 Alpha and Omega Semiconductor AOS showcases its latest power semiconductor solutions at electronica targeting key industries like automotive industrial and renewable energy Highlights include AOS Gen2 SiC MOSFETs in advanced packages including two AEC-Q101 automotivequalified surface mount options for extreme power density AOS has also several SiC modules and SiC MOSFETs New Motor Drive ICs AOS will announce a new range of 60V and 100V driver ICs for power tools outdoor garden equipment and emobility applications including a 100V halfbridge driver IC a 100V 3-phase driver IC and a 60V 3-phase driver IC Power Supply and Renewable Energy Asignificant solution in AOS’ growing High-Voltage Super Junction MOSFET portfolio is its industryleading optimized αMOS5 600V to 700V Super Junction MOSFETs Intelligent Power Modules Mega IPM7 AOS has integrated its latest RC IGBT and highvoltage gate driver into the world‘s most compact package design delivering mega power of up to 100 Win motor control applications AOS will also show innovative packaging solutions and its line of automotive MOS-FETS st Alpha and Omega Semiconductor Hall C4 Booth 102