Der Blätterkatalog benötigt Javascript.
Bitte aktivieren Sie Javascript in Ihren Browser-Einstellungen.
The Blätterkatalog requires Javascript.
Please activate Javascript in your browser settings.
When it comes to components the trend is toward smaller chips with higher power densities and ultrafast switching speeds Here the goal is not only increased chip ruggedness at elevated operating temperature ratings a more significant aim is to deliver outstanding reliability in order to achieve the desired applicationspecific lifetime Material science is pivotal to mastering these challenges – with innovative new materials that deliver the necessary thermal management isolation properties and matching coefficients of thermal expansion At the PCIM Europe 2024 innovations in this area will include new ceramics and chip passivation materials as well as new chip bonding technologies such as advanced soldering or sintering technologies In packaging and interfacing technology the spotlight is on smart scalable power electronic building blocks or power embedding which aims to achieve a single shared platform for power modules that will meet applicationspecific requirements Encompassing power chips integrated sensors and digital control of power devices this platform should be scalable in terms of current and voltage ratings Here too module design and material science are key to tackling heat transfer and managing all the parasitics inside the power block We’ll have several papers about scalable power electronic building blocks with a focus on establishing new standards and modularization And we’ll show a new approach to designing power modules for the tiny ultrafast switching WBG wide bandgap devices that addresses the many associated challenges This year’s PCIM Europe highlights the following fields of application the mobility sector the energy sector and data centres In all three fields there’s a need for more compact power converters operating at high efficiency ratings not least for mobile applications As with components increased power densities can pose tough thermalmanagement challenges – especially in the fastestgrowing application area data centres Greater efficiency will be key to meeting these demands and ensuring that power converters are reliable and have long useful lifetimes in their widely differing applications and operating environments We’ll be showing some impressive innovations in the various fields of application – with a particular focus on electromobility Interest in AI and its practical applications has grown rapidly in recent years So it’s hardly surprising that the technology is becoming increasingly important in power electronics Deploying AI and digital twins promises shorter development time and faster timetomarket plus more reliable converter products During ongoing operations AI and digital twins will play a central part in predictive maintenance – for example by helping determine how components are aging Here there’s a need for industry standards to gauge the reliability of the vast volumes of data involved What’s more we need to think about how the digital world relates to the real world so that we can translate insights from the former to the latter One of this year’s keynotes focuses on AI and we’ll see a good example of how AI is applied in the realworld production of a power converter We’ll also see the benefits that AI has to offer across the entire product lifecycle – from the initial idea for a new converter to product development and production right through to decommissioning One of the most important topics for the future is sustainability Not only are zero carbon emissions a must we must also significantly reduce the amount of electronic waste which has risen by 80% in the past decade alone This will call for a fundamental rethink and a move to a circular economy Achieving this will entail considering ways of repairing converters and recycling all materials so that we can reuse them One extremely important factor here will be acquiring the dataset needed to accurately calculate the carbon footprint of components and systems We also have several papers about design for sustainability focusing on carbon footprint and lifecycle assessment with special emphasis on the dataset needed to calculate this footprint and on cost of ownership We hope you enjoy reading the first edition of the PCIM Magazine Sincerely Prof Dr Leo Lorenz Industry news Five key areas for power electronics in 2024 Prof Dr Leo Lorenz President ECPE European Center for Power Electronics e V General Conference Director PCIM Conference At the PCIM Europe 2024 we’ll be highlighting five key areas of development spanning the entire power electronics value chain This year’s event features a wide range of presentations outstanding innovations and keynotes focusing on the following topics components new materials for packaging and interfacing technologies geared to improving reliability and extending lifetimes various fields of application artificial intelligence AI and digital twins and system design for sustainability 5 PCIM Magazine 01 2024