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embedded world – the official daily 2024 Messe-News Mittwoch 10 04 2024 3 Increased processing power New mixed signal oscilloscope generation Anew computing platform increases the responsiveness of Tektronix new Mixed Signal Oscilloscopes 4 Series Bby a factor of 2 paired with a user friendly interface and remote operation capabilities This is the latest generation of Tektronix Mixed Signal Oscilloscopes The 4 Series B MSOs offer the same high signal fidelity as the earlier version 4 Series with bandwidths from 200 MHz to 1 5 GHz realtime sampling at 6 25 GS s and up to 16 bit vertical resolution It also includes the same madefortouch user interface but with an upgraded processor system Customers will note that the 4 Series B MSO user interface is twice as responsive and boasts significantly accelerated advanced analysis The 4 Series B MSO is available with up to six input channels making it well suited for threephase power analysis and exclusive Spectrum View provides multichannel spectrum analysis in sync with time domain waveforms Along with accelerating frontpanel operation the upgraded processor system also speeds up remote operation The 4 Series B MSO can be remotely accessed and controlled using a simple web browser dedicated TekScope PC software or custom program via a full programming interface The 4 Series Benhances time to answer on over 25 serial decode packages for interchip automotive power aerospace buses and more Additionally it speeds up algorithms and plotting used in existing analysis packages for power supply measurements motor drive analysis and double pulse testing nw Tektronix Hall 4 Stand 314 electronic displays Conference 2024 Welcome to innovation technology and trends Eight keynotes five session keynotes as new concept and 45 technical presentations and about 20 poster contributions set a new record for the electronic displays Conference edC Experience innovations by international experts and discuss latest topics in an excellent networking atmosphere on April 10 and 11 at the Nuremberg Messe Congress Center Participants at the edC can anticipate stimulating presentations on innovations and will have a variety of opportunities for discussion at the “Author Interviews” and the poster sessions as well as the accompanying exhibition in the “electronic displays Area” in Hall 1 of the embedded world trade fair This networking in combination with visual experience has in the past often led to new ideas and solutions and eventually to joint projects Eight keynotes will cover a wide spectrum from market studies to automotive trends and innovations The 15 technical sessions incl session keynotes and the posters will cover all relevant areas of professional display applications Full array local dimming LCDs MicroLEDs reflective displays automotive topics optical measurements touch AR VR and for the first time a session on industrial display market research All contributions have been carefully evaluated so the attendees of the edC get proven insights from leading experts The presenters come from SMEs large companies and academia thus ensuring views on displays from different perspectives The edC 2024 also features a further increase in the large number of international speakers This also demonstrates the growing and equally important internationalization of edC Furthermore the conference committee welcomes three new members Prof Jan Bauer from Karlsruhe University ex-Mercedes Dr Ingo Rotscholl TechnoTeam and Martin Zobl BMW All are renowned in the display community and have presented and attended edCs many times in the past This move ensures further growth and continuity of our edC After the sessions the edC traditionally offers the opportunity for oneonone discussions with the speakers at the “Author Interview Tables” The accompanying poster session will surely lead once again to constructive discussions during the coffee breaks Due to the high number of posters we will honor the best poster with a new award based on the voting of the attendees Casual networking and a lively exchange of opinions will animate the luncheon Many new concepts and collaborations are sure to emerge here again this year Seeing is believing the “electronic displays Area” of the embedded world trade fair which once again fills about half of Hall 1 offers not only visual impressions but at the same time also opportunities to engage in technical discussions with exhibitors New display technologies and supply chain might be frequently addressed topics in 2024 The electronic displays Conference is powered by Elektronik embedded world DFF presented by WEKA Fachmedien and WEKA Events Contributing to the success of this year’s edC are the sponsors Admesy Instrument Systems Konica Minolta Next System SphereOptics and TechnoTeam Avisit to Nuremberg for edC 2024 is well worthwhile – trends technology and innovation in displays and display components form the basis for bringing products to market successfully Yours Prof Dr Karlheinz Blankenbach interfaces and more flexibility in the accelerator units – this makes it difficult to establish a standard With the “TQMa95xxSA” you are presenting here at embedded a SMARC module with NXP‘s i MX95 processor How does that fit into the overall picture? On the one hand SMARC was designed to be more independent of any specific CPU architecture than most other standards Secondly the i MX95 offers a range of functions and interfaces that are well suited to this standard and this allows us to utilise most of the interfaces of the SMARC standard In order to make all of the CPU‘s signal pins available to our customers we have also developed the “TQMa95xxLA” a 44 × 44 mm² solder module with a proprietary pinout The functions of the i MX95 enable this dual approach But is this strategy not applicable to all processors? Yes but it has its limits With the AM67xx processor from Texas Instruments for example we would have lost too much functionality if we had reduced it to a standard We are therefore designing our “TQMa67xx” in a proprietary way in order to open up the full potential of this interesting CPU to developers Among other things TI is expanding its wellknown DSP architecture to include deep learning accelerators Developers can thus take their DSP expertise to a whole new level and into new application areas This makes our TQMa67xx suitable for demanding signalling image processing and edge AI applications and extends our TI portfolio of AM62 AM64 and AM65 modules upwards In the case of Intel Core Ultra processors TQ has opted for the recently ratified COM-HPC Mini standard Why did you choose to go that route? Our “TQMxCU1-HPCM” module supports the new Intel Core Ultra processors With the recently integrated neural processing unit NPU and significantly increased CPU and graphics performance the focus is clearly on graphics AI and dataintensive applications that require a number of highspeed interfaces such as PCIe Gen5 and USB 4 COM-HPC Mini offers the best pinout for this and above all it is futureproof Furthermore COM-HPC Mini is 26 per cent smaller than comparable COM Express Compact modules and as much as 46 per cent smaller than products in COM-HPC‘s smallest “client format“ to date What overall trend do you see in the embedded industry? The answer is clearly greater heterogeneity It starts with the processors which offer an increasingly diverse mix of cores and accelerators This continues at the system and network level through to software in fact application software can utilise a mix of several operating systems and programming languages But developers can continue to rely on monolithic raw iron programming depending on what is best for their project We at the TQ Group want to support them in this because we are convinced Proprietary or standard? Use both By Tobias Schlichtmeier TQ-Group Hall 3 Stand 249 Continued from page 1 According to Tektronix both signal analysis and touch operation as well as the new remote control functions benefit from the faster processor system of the MSO Series 4B Image Uwe Niklas