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productronica 2025 New Products www plasmatreat com Weltneuheit Partikelfreie Openair-Plasma ® Düse für höchste Reinheit und Prozesssicherheit Halle B1 Stand 136 Halle A2 Stand 445 Anzeige SUSS MicroTec High Precision Dieto-Wafer Hybrid Bonding SUSS introduces the XBC300 Gen2 D2W platform – a customized bonding solution that completes the company‘s hybrid bonding portfolio This new platform underscores SUSS‘ position as an industry leader in providing a fully integrated D2W hybrid bonding solution for demanding manufacturing requirements The new SUSS »XBC300 Gen2 D2W« platform process solution enables dietowafer D2W bonding on 200 mm and 300 mm substrates and meets the most demanding interdie spacing requirements It is an ideal platform to produce highprecision chips thanks to industryleading footprint savings of up to 40 percent and a postbond accuracy of < ±200 nm With the integrated platform all process steps in particular surface activation and die positioning are carried out in a single fully automated solution The integration ensures greater cleanliness and improved process control compared to modular competitor solutions »With our new XBC300 Gen2 D2W dietowafer platform we have completed our hybrid bonding portfolio consisting of our highperformance wafertowafer platform and our combined D2W W2W solution « explains Dr Robert Wanninger Senior Vice President Advanced Backend Solutions at SUSS D2W bonding is an advanced semiconductor manufacturing process that precisely dielectrically and metallically bonds individual chips together on wafers to create highly precise stable and conductive tracks The new SUSS platform is ideal for 3D IC technologies for efficient processing of multiple die layers on top of each other for example in highbandwidth memory HBM applications »Our XBC300 Gen2 D2W hybrid bonding platform offers yieldoptimized performance especially in the production of stacked dies It enables us to make production efficient and reliable by using only known good dies « says Markus Ruff Head of Product Line Bonding at SUSS The »XBC300 Gen2 D2W« platform which is already available for customer demonstrations at the Application Center in Sternenfels Germany was developed in close collaboration with SET Corporation SA a leading specialist in flipchip bonders The integration of SET‘s ultraprecision die bonder into the SUSS platform creates a powerful fully integrated platform that meets the needs of the industry in research development and highvolume manufacturing ha SUSS MicroTec Hall B1 Booth 600 Omron AIsupported fault analysis Networked SPI AOI and AXI systems with AIsupported fault analysis and automation are the focus of Omron‘s trade fair presentation The solutions combine control motion sensor technology safety and image processing into a platform that enables fault detection and process optimisation in electronics manufacturing The focus is on AIbased algorithms that adapt independently achieving high precision in the inspection of SMT electronic and semiconductor assemblies All inspection systems are built using Omron‘s own automation technology and can be networked across production lines The aim is to achieve consistently controlled and flexible manufacturing The systems on display include ● VP01G SPI 3D solder paste inspection with multiresolution zoom up to 5 µm and closedloop connection to printing and placement systems ● VT-S1080 AOI Optical inspection with AIcontrolled image analysis for demanding assemblies ● VT-X750 AXI Inline CT Xray inspection for concealed solder joints with reduced scan times In addition to its own stand Omron will also be presenting applications from electronics and semiconductor manufacturing together with the Fraunhofer Institute IFAM in Hall B2 Stand 539 nw Omron Hall A2 Booth 435 Hall B2 Booth 539