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www markttechnik de Die offizielle Messezeitung 13 New Products productronica 2025 WE CREATE MOTION Kompakte FAULHABER Kleinstantriebe ermöglichen humanoiden Roboterhänden feinfühlige Bewegungen die es in Präzision und Geschwindigkeit mit ihrem menschlichen Vorbild aufnehmen können www faulhaber com humanoidrobotics de Antriebssysteme für Humanoide Robotik FAULHABER Applikationen München 18 – 21 11 2025 Halle B2 Stand 101 Solderstar WaveShuttle O₂ for Advanced Wave Soldering Verification Solderstar will unveil its latest patentpending verification tool the WaveShuttle O₂ at Productronica 2025 Building on the success of the original WaveShuttle this advanced version adds realtime oxygen measurement creating a comprehensive verification solution that captures all key process parameters from a wave soldering machine in a single pass WaveShuttle O₂ measures seven critical parameters temperature profile wave contact wave height line speed inclination angle process vibration and oxygen concentration The addition of oxygen monitoring allows engineers to correlate solder quality with atmospheric conditions define and maintain optimal process ranges and quickly detect leaks or gas supply issues ensuring reliable consistent solder joints and longterm process stability Chris Williams Head of European Sales at Solderstar said »Wave soldering remains a critical process for electronics manufacturers and WaveShuttle O₂ represents a major step forward in process verification The addition of oxygen measurement gives engineers unprecedented control over the soldering atmosphere while our multiparameter approach monitors machine performance and board exposure with complete confidence reducing defects and optimising throughput « The WaveShuttle O₂ features precision titanium contact sensors that directly measure wave contact along with wave height and line speed An integrated threeaxis vibration sensor continuously monitors mechanical movement detecting instability caused by worn components misaligned tooling or machine resonance By identifying vibrationrelated risks such as skewed components solder bridges or disturbed joints engineers can intervene early reduce downtime and implement predictive maintenance strategies to maintain stable highyield production conditions Inclination sensors measure actual angles the PCB will experience during wave soldering revealing discrepancies due to program settings or poorly performing conveyor systems This ensures boards enter and exit the solder wave at optimal angles minimising bridging and enhancing joint quality The system enables highly accurate conveyor adjustments and tracks gradual process drift over time supporting repeatable solder performance across multiple production runs The integrated oxygen sensor monitors residual oxygen levels in real time directly within the soldering environment This helps verify Nitrogen inerting performance reduce oxidation and dross formation and maintain stable consistent solder joints This is particularly valuable for leadfree soldering processes which are more susceptible to oxidation Constructed from robust ESD composite and titanium materials with custom productions sizes available WaveShuttle O₂ integrates with Solderstar’s SLX datalogger platform enabling manufacturers to distinguish between machinelevel inconsistencies and PCBspecific issues Its multiparameter verification approach sets a new benchmark for wave soldering process control Visitors to Productronica 2025 will be able to view the WaveShuttle O₂ together with the new VP-10 Thermal Profiler and Vapor Shuttle Verification Fixture which are also being showcased ha Solderstar Hall A4 Booth 220 Omron Highspeed 3D Xray inspection Omron’s automatic highspeed 3D Xray inspection systems VT-X950 VT-X750-XL and VT-X850 are designed to meet the increasingly complex demands of semiconductor manufacturing and other advanced industries The latest system the VT-X950 stands out as the first model in the VT series specifically designed to support clean rooms making it ideal for midprocess semiconductor environments such as wafertowafer bonding processes With the expansion of generative AI data centers and 5G 6G communications semiconductor miniaturization has reached new levels of complexity The shift towards 3D packaging and integrated EV modules particularly in the automotive industry demands more precise inspections that traditional 2D-Xray systems can‘t meet Omron‘s VT Series addresses these challenges with advanced 3D inspection technology The VT-X950 is equipped with a feature that automatically changes inspection settings to accommodate sudden changes in production items due to fluctuating demand By referencing measurement points and inspection settings registered in advance in the production control system the system automatically adjusts to the appropriate conditions for each production item This reduces startup losses and the need to manually reset inspection settings In addition the VT-X950 includes a conveyorbased automatic loading and unloading function contributing to automation and manpower savings in the manufacturing process The VT-X950 features technology that captures stereoscopic images without stopping ensuring continuous inspection This is particularly beneficial in highvolume production environments Additionally it supports the inspection of bump electrodes formed with a narrow pitch to bond IC devices together The system also leverages AI technology and deep learning to process captured images ensuring accurate identification of defective products ha Omron Hall A2 Booth 435