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www markttechnik de Die offizielle Messezeitung 9 Equipment productronica 2025 Follow us Innovate Test Repeat Innovative Produkte brauchen eine zukunftsorientierte Qualitätssicherung Deshalb sind unsere präzisen Testsysteme die effizienteste Lösung für Messund Testserien an elektronischen Baugruppen in der laufenden Produktion mcdelektronik de Visit us Hall A1 Booth 155 EV Group Hybrid Bonding Overlay Control for Chiplet Integration EVG´s »40 D2W« is the first dedicated dietowafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments With up to 15X higher throughput than EVG’s industry benchmark »EVG 40 NT2« system designed for hybrid wafer bonding metrology the new »EVG40 D2W« enables chipmakers to verify die placement accuracy and take rapid corrective action improving process control and yield in highvolume manufacturing HVM The »EVG40 D2W« can be used for any D2W bonding application including chiplet integration highbandwidth memory HBM stacks and 3D system on chip SoC integration processes which enable highperformance devices for artificial intelligence AI highperformance computing HPC data centers and other applications Multiple EVG40 D2W systems have already been installed at customer sites and are being used in HVM production services D2W bonding integrates diverse dies or chiplets of different sizes materials and functions into a single device or package This is essential for creating devices and systems that meet the increased performance demands of applications like AI and autonomous driving with lower power consumption As interconnect pitches in 3D packaging become tighter with each new product generation die bond alignment and overlay processes must also scale accordingly not only with greater accuracy but also higher measurement coverage to identify overlay errors that can lead to misaligned copper pads or bond interfaces and result in yield loss Current D2W bond overlay metrology systems utilize »moveacquiremeasure« techniques inherited from wafertowafer W2W bond overlay metrology systems which exceed the measurement precision while lacking the throughput necessary for D2W bond overlay metrology To achieve faster run rates these systems must reduce sampling sizes resulting in sparse alignment information that can lead to inaccurate feedback for process correction At the same time integrated metrology solutions in pick and place D2W bonding systems are less flexible and do not have sufficient accuracy for leadingedge applications The »EVG40 D2W« has several hardware and software enhancements to achieve precise 100 percent overlay measurements across all dies on a 300-mm wafer without impacting throughput ● Enhanced throughput via duallayer measurement of alignment targets on both the die and the base wafer in a single pass ● Highspeed precision from a new stage design which ensures synchronization between image capture and stage movement ● Consistent accuracy thanks to a modified light source which maintains proper levels of illumination for precise measurements ● Highquality image capture enabled by large focal offset ensuring high signaltonoise ratio when the focal plane of alignment targets differs between base and top chiplets EV Group is steadfast in its commitment to developing new products and capabilities that push the performance envelope and solve our customers’ most complex integration problems The dietowafer bonding process is particularly challenging since the integration of different types of chips nodes and materials requires comprehensive metrology in production environments to better understand and improve the bonding process without sacrificing throughput Designed from the ground up as a dedicated D2W metrology tool the EVG40 D2W delivers the highest throughput of any system in its class« says Paul Lindner executive technology director at EV Group Measures up to 2800 overlay measurement points across the wafer in just four minutes delivering 100 percent die positioning feedback without sacrificing throughput ● Measurement precision supports requirements for leadingedge D2W bonding applications ● Uses an advanced model to calculate placement distortion rotation and runout variation for each die ● Feeds measurement results back to the fab’s host system for analysis enabling optimization of D2W overlay and bonding process for future wafer runs ● Can be used alongside any thirdparty D2W bonding system to ensure the highest possible level of quality control ● Complements EVG’s suite of tools for D2W bonding including the EVG320 D2W activation and cleaning system ha EV Group Hall B1 Booth 241 The »EVG40 D2W« system is the first dedicated dietowafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments Image EV Group